High adhesion even to difficult-to-plate materials

Plating primer that enables high adhesion plating to various substrates (resin, ceramic, glass, etc.)

◆Features of “Metalloid”

・No etching required, smooth plating film with good adhesion.
・High adhesion to difficult-to-plate materials such as glass.
・Short process with little waste liquid, printable.
・Coating film is thin (several tens to several hundreds of nm) and has good transparency.

◆”Metalloid” Cu plating film and peel strength of each substrate.

SubstratePeel strength
ABS COP PP Polycarbonate
Nylon Polyimide Elastomer
10 N/cm
Glass Tempered Glass
Quartz Glass Alumina
8 N/cm
PET LCP PTFE Si Wafer
Polyphenylene Ether (PPE)
Polyphenylene Sulfide (PPS)
6 N/cm
Epoxy SiN SiC 4 N/cm

◆Glass Interposer (TGV)

〇 Low temperature process (120℃).
〇 High adhesion and coating ability to TGV.

◆Roll-to-roll plating process for 5G

〇 Thin (≦2 μm) Cu film can be formed.
〇 Plating interface is smooth → low transmission loss

◆High-definition Cu patterning

〇 High-definition Cu patterns can be formed in a short process.

◆Plating on fibers and powders

〇 Plating on fibers, nonwoven fabrics, and powders is also possible.